internal thermal resistance

基本解釋

Curves of internal thermal resistance of different typical structures vs. heating chip areas and external resistance vs. package surface areas are plotted.
繪制了多種典型結(jié)搆的內(nèi)熱阻與發(fā)熱芯片麪積的關(guān)系曲線和外熱阻與封裝表麪積的關(guān)系曲線；
We also find that under isothermal boundary condition, due to heat can be distributed in time, the internal thermal resistance and heat distribution leading role on the module temperature rises.
等溫邊界條件下熱量能夠及時(shí)散發(fā)，內(nèi)部熱阻和熱源分佈對(duì)模塊溫陞起主導(dǎo)作用。
The power output of the thermal battery is most dependent on the battery internal resistance.
熱電池的內(nèi)阻大小直接影響著電池的負(fù)載能力。