internal thermal resistance

基本解釋

Curves of internal thermal resistance of different typical structures vs. heating chip areas and external resistance vs. package surface areas are plotted.
繪制了多種典型結構的內(nèi)熱阻與發(fā)熱芯片面積的關系曲線和外熱阻與封裝表面積的關系曲線；
We also find that under isothermal boundary condition, due to heat can be distributed in time, the internal thermal resistance and heat distribution leading role on the module temperature rises.
等溫邊界條件下熱量能夠及時散發(fā)，內(nèi)部熱阻和熱源分布對模塊溫升起主導作用。
The power output of the thermal battery is most dependent on the battery internal resistance.
熱電池的內(nèi)阻大小直接影響著電池的負載能力。