extreme thermal environment

Heat dissipation mode in an infinite space and extreme thermal environment is numerically studied and optimized for a PCB through improving the structure of a sun shield,modifying the layout of the PCB,and setting an insulation cavity.
通過改進(jìn)太陽罩結(jié)搆、改變PCB安裝形式、設(shè)置隔熱等方式,對(duì)大功率PCB在大空間極限熱環(huán)境下的散熱方式進(jìn)行了優(yōu)化和數(shù)值模擬。