extreme thermal environment

Heat dissipation mode in an infinite space and extreme thermal environment is numerically studied and optimized for a PCB through improving the structure of a sun shield,modifying the layout of the PCB,and setting an insulation cavity.
通過改進太陽罩結(jié)構(gòu)、改變PCB安裝形式、設(shè)置隔熱等方式,對大功率PCB在大空間極限熱環(huán)境下的散熱方式進行了優(yōu)化和數(shù)值模擬。