bga

常見例句

Fitting option BGA nozzle ensures excellent result and efficient.
選購專用BGA風(fēng)咀,使拆銲傚果更佳及操作更快捷。
Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形銲點(diǎn)陣列封裝需要倒裝銲。
This method meets the needs of the on-line test of BGA coplanarity.
該測量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實(shí)時(shí)在線檢測的需要。
BGA measurement is measured for inside solder point.
BGA量測以最內(nèi)側(cè)銲點(diǎn)爲(wèi)量測依據(jù)。
This procdure provides instruction for lead free BGA reballing process.
該程序爲(wèi)無鉛。
SMT maintain, BGA chip rework, the good solderability, the low smog.
SMT維脩、BGA芯片銲接與植球，活性強(qiáng)，低菸霧。