bga

常見例句

Fitting option BGA nozzle ensures excellent result and efficient.
選購專用BGA風(fēng)咀,使拆焊效果更佳及操作更快捷。
Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊點陣列封裝需要倒裝焊。
This method meets the needs of the on-line test of BGA coplanarity.
該測量方法可以滿足BGA(球腳陣列)封裝引腳尺寸的實時在線檢測的需要。
BGA measurement is measured for inside solder point.
BGA量測以最內(nèi)側(cè)焊點為量測依據(jù)。
This procdure provides instruction for lead free BGA reballing process.
該程序為無鉛。
SMT maintain, BGA chip rework, the good solderability, the low smog.
SMT維修、BGA芯片焊接與植球，活性強(qiáng)，低煙霧。