thermal-oxidation curing

基本解釋

• [機(jī)械工程]熱氧化交聯(lián)

英漢例句

雙語(yǔ)例句

• During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.
  在集成電路封裝工藝過(guò)程中，對(duì)導(dǎo)電膠進(jìn)行無(wú)氧化加熱固化的質(zhì)量直接決定了集成電路的質(zhì)量和使用壽命。

• thermal-oxidation curing更多例句

專業(yè)釋義

機(jī)械工程

• 熱氧化交聯(lián)