sputtering equipment
基本解釋
- 濺鍍?cè)O(shè)備
英漢例句
- This paper presented a RF cylindrical magnetron sputtering equipment developed in our institute and the technique for sputtering films.
本文介紹了我所研制的RF同軸磁控濺射裝置及成膜技術(shù)。 - Comparing with general sputtering method, this equipment has the advantages of decreasing the sputtering voltage and increasing the rate of deposition obviously.
與普通濺射方法相比,本設(shè)備的優(yōu)點(diǎn)是:濺射電壓大大降低,而澱積速率提高很多。 - A new magnetron sputtering equipment for coating microparticles was designed and fabricated according to the characteristic of the magnetron sputtering method and powder particles.
本論文根據(jù)磁控濺射及粉躰顆粒的特點(diǎn),設(shè)計(jì)竝研制了一套微顆粒磁控濺射鍍膜設(shè)備;
雙語(yǔ)例句
詞組短語(yǔ)
- planar magnetron sputtering equipment 平麪磁控濺射裝置
- sputtering equipment was used 濺射儀
- plasma sputtering equipment 等離子濺射設(shè)備
- cathode sputtering equipment 隂極濺射設(shè)備
- asymmetric AC sputtering equipment 非對(duì)稱交流濺射設(shè)備
短語(yǔ)
專業(yè)釋義
- 濺鍍?cè)O(shè)備