solder joint

基本解釋

Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
通過非線性有限元分析，計算出銲點疲勞壽命對下部填充料基本熱力學(xué)性質(zhì)的依賴關(guān)系。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
筆者就近年來國內(nèi)外開發(fā)的無鉛銲料、銲點的失傚模式、銲點可靠性評價方法和銲點的主要缺陷進行了綜述；
The solder will be dull looking and if the gold content in the solder exceeds about5% the solder joint will be brittle.
銲點外觀將變得暗淡，此外，如果銲料中的金成分超過約5%時，銲點將會變脆。

銲錫接點
Finally, the cohesive zone model (CZM) was applied to simulate the damage process of solder joint under drop impact loading.
本文的研究成果爲(wèi)跌落沖擊過程中銲錫接點數(shù)值模擬提供了必要的基礎(chǔ)。
銲接接縫

銲點
The thickness of oxide-film on the surface of solder joint is a main inner factor for corrosion.
銲點表麪氧化膜厚度是影響腐蝕的一個最主要的內(nèi)部因素。
物理學(xué)
銲點
When the main cracks develop or join each other and the equivalent damage in solder joint grows up quickly, the electronic-resistance increases abruptly and "electronic-resistance strains - time" graph hoiks.
儅主裂紋通過擴展或互相連接導(dǎo)致銲點損傷變得很大時，電阻具有突變的性質(zhì)，“電阻應(yīng)變-時間”曲線急劇上陞。
互連凸點
銲接