multi wire-saw

基本解釋

At present, the multi-wire saw has already replaced ID saw in longer ingot of semiconductor material slicing.
目前，在較長的矽單晶錠切割領(lǐng)域，多線切割機(jī)已基本取代內(nèi)圓切片機(jī)。
The overall structure of multi-wire saw was analyzed and its work principle was explained. The realization diagram of hardware and software was given for control system.
分析了多線切割機(jī)的縂躰結(jié)搆，說明了它的工作原理，給出了其控制系統(tǒng)的硬件和軟件實(shí)現(xiàn)框圖。
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Multi-wire slicing is a novel method in the field of wafer slicing; recently multi-wire saw has gradually replaced the method of ID saw, and become the prevailing equipment in this domain.
多絲切割是一種新型的矽片切片加工方法，近年來多絲切割已經(jīng)逐漸取代內(nèi)圓切割成爲(wèi)矽片切片加工的主流。