gap-fill

基本解釋

HDP have better gap fill capability than the typical PECVD technology to meet smaller features with higher aspect ratio requirement.
爲(wèi)了滿足深亞微米集成電路工藝對(duì)成膜特性的要求，開(kāi)發(fā)出了高密度等離子躰化學(xué)氣相澱積薄膜（HDP）技術(shù)。
Adopt unique signal gap filling technology, with good coverage, realizing seamless interference.
採(cǎi)用獨(dú)特的信號(hào)空隙填充技術(shù),具有良好的覆蓋性,實(shí)現(xiàn)了無(wú)縫乾擾。
The new series of golf holidays fill a gap in the market.
新的高爾夫度假系列填補(bǔ)了市場(chǎng)的一個(gè)空白。
Mistakes were corrected and gaps filled.
錯(cuò)誤改正了,缺點(diǎn)也彌補(bǔ)了。
Tungsten is widely used in multi-level interconnection due to its excellent gap filling and anti-electromigration capability.
鎢由於其優(yōu)良的抗電遷徙性能和宜加工特性而被廣泛應(yīng)用於多層金屬互連技術(shù)中。