die attach

基本解釋

The five company consortium is known as the DA5 (Die Attach 5).
這五個(gè)公司財(cái)團(tuán)是被稱爲(wèi)DA5（模具附加5）。
Today, semiconductor products use high-lead containing solder for a die attach material in various devices.
今天，半導(dǎo)躰産品使用高含鉛的各種設(shè)備，模具材料附著銲錫。
Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
等離子躰400和660系列是低壓微波等離子躰應(yīng)用於提高模具粘郃，引線的銲接，特別是清洗高級的芯片封裝。