wafer bonding

基本解釋

Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整體結(jié)構(gòu)圓片級(jí)真空封裝的同時(shí)，通過(guò)引線腔結(jié)構(gòu)方便地實(shí)現(xiàn)了中間電極的引線。
A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.
本文介紹了將我們開(kāi)發(fā)的硅片粘合技術(shù)與傳統(tǒng)V形槽隔離工藝相結(jié)合而研制成功的一種新的介質(zhì)隔離方法。
Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.
晶圓鍵合可以使得經(jīng)過(guò)拋光的半導(dǎo)體晶圓在不使用粘結(jié)劑的情況下結(jié)合在一起。