thermosonic

基本解釋

• 熱超聲

同根派生

• thermosonic相關(guān)詞

英漢例句

• The dynamic optimum design of high-frequency ultrasonic transducer was studied to improve thermosonic packaging efficiency and reduce packaging temperature.
  為提高熱超聲封裝效率、降低封裝溫度,研究了高頻超聲換能器的動力學(xué)優(yōu)化設(shè)計。
• The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface.
  采用壓力約束模式夾持倒裝芯片,實現(xiàn)了熱超聲倒裝鍵合,觀察到環(huán)狀的鍵合界面微觀形貌,脊?fàn)钏毫牙庖约氨砥铀槠?/li>
• Schwizer, J., et al., 1999, ”Thermosonic ball bonding: Friction model based on integrated microsensor measurements,” Electronics Manufacturing Technology Symposium, 24th IEEE / CPMT, pp.108-114.
  陳津佑，2000，電子構(gòu)裝熱超音波焊線制程之介面能量理論模式的建立及其應(yīng)用，國立中正大學(xué)機(jī)械工程研究所，碩士論文。
• Thermosonic Flip Chip Bongding for Power LED Chips
  功率型LED芯片的熱超聲倒裝技術(shù)
• Formation of circle band interface of thermosonic flip chip bonding
  熱超聲倒裝鍵合環(huán)狀界面的形成

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