solder paste

基本解釋

Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：應(yīng)用加熱金屬涂敷層的表面和預(yù)涂焊膏，熔融，連接和凝固兩個金屬涂層。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考慮其他焊膏印刷性能影響因素下，較高的印刷速度和印刷壓力能提高焊膏印刷性能。
Equipment specifically designed for use with solder paste.
于專為錫膏設(shè)計的設(shè)備中使用。

焊膏
A kind of solder paste material was successfully developed.
研制出了新的無鉛焊膏材料。
膏狀釬料
Based on these tests, it proved that copper solder paste had a good wettability, and mechanical properties of brazed joints could reach the request.
證明了紫銅膏狀釬料具有良好的潤濕性,其釬焊接頭機械性能均達(dá)要求。
電子、通信與自動控制技術(shù)
焊膏
Mini-stencil is the traditional method used in the electronics manufacturing industry for the deposition of solder paste onto reworked component sites.
最小型模板用于把焊膏淀積到返修的元件部位的電子制造業(yè)的傳統(tǒng)方法。
機械工程
焊钖膏
焊膏