microwave power device

基本解釋

Burn-out of a microwave power device due to the poor bonding between beryllium oxide and base metal sink was investigated using Sound Scanning technique.
利用聲學(xué)掃描檢測(cè)技術(shù)，提示了熱燒毀的微波功率器件氧化鈹陶瓷基片與底座金屬散熱片的焊接不良現(xiàn)象；
A novel structure has been designed and applied in metallization system of microwave power device, in which backflow effect is taken to increase the electromigration resistance.
在回流動(dòng)力學(xué)理論和實(shí)驗(yàn)研究的基礎(chǔ)上，將回流加固結(jié)構(gòu)應(yīng)用于實(shí)際微波功率器件。
In recent years, experiments show that in the plasma loaded high power microwave device may obtain much higher interaction efficiency and output power than the ones absence of plasma.
近年來(lái)實(shí)驗(yàn)研究發(fā)現(xiàn)，等離子體加載高功率微波器件后，器件的輸出功率和互作用效率得到顯著的提高。