cu powder

基本解釋

Tin coated flake Cu powder was obtained by electroless tin plating with hypophosphite as reducing agent.
采用次磷酸鈉作還原劑，在片狀銅粉表面化學(xué)鍍錫，得到片狀錫包銅粉。
Because the interface migration is unidirectional, so only Ni can diffuse into Cu powder and the Cu can′t diffuse almost into the Ni powder.
銅粉和鎳粉在反應(yīng)過程中，只有鎳粉顆粒進(jìn)入銅粉顆粒、銅幾乎不進(jìn)入鎳，界面單向遷移、單向空位擴(kuò)散是其密度和硬度下降的主要原因。
The results indicate that good coating quality tin coated flake Cu powder with well electric conductivity and loose specific gravity can be obtained by controlling technological parameters.
結(jié)果表明：通過控制工藝參數(shù)可以獲得鍍覆質(zhì)量好，且具有很好導(dǎo)電性和低松裝密度的片狀錫包銅粉產(chǎn)品。