bevel angle

基本解釋

Nearly any bevel angle can be machined into the wafer which remains after etching.
顯然，任何斜角都能夠加工到晶片內(nèi)，并在蝕刻之后保留。
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According to current specification, the bevel angle is only based on experienced value and a complete calculation method is not available.
排汽管斜切口出流時的偏轉(zhuǎn)角，按現(xiàn)行規(guī)范只有一點經(jīng)驗值而缺少完整的計算方法。
The effects of choosing lapping bevel angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
討論了在檢測半導(dǎo)體器件和集成電路芯片時，不同研磨傾斜角度對擴展電阻量值的影響。
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